@article {10.3844/ajassp.2008.626.632,
article_type = {journal},
title = {Low-g Area-changed MEMS Accelerometer Using Bulk Silicon Technique},
author = {Bais, Badariah and Majlis, Burhanuddin Yeop},
volume = {5},
year = {2008},
month = {Jun},
pages = {626-632},
doi = {10.3844/ajassp.2008.626.632},
url = {https://thescipub.com/abstract/ajassp.2008.626.632},
abstract = {A bulk micromachined accelerometer based on an area variation capacitive sensing for low-g applications was developed. The accelerometer was designed with ribbed-style fingers structure on the movable mass connected in parallel and suspended over stationary electrodes composed of differential comb fingers by means of suspension beams anchored onto the substrate. A folded, rigid truss suspension design with low spring constant and low cross-axis sensitivity was chosen. The simulation was performed using Coventorware software. A three-mask bulk micromachining wafer bonding fabrication process was utilized to realize the accelerometer. Silicon-on-glass was used to achieve high sensitivity and low mechanical noise while maintaining a simple structure. The general concept, main design considerations, fabrication procedure and performance of the resulted accelerometer was elaborated and presented. A linear relationship between the differential capacitance and acceleration was obtained. The accelerometer sensitivity was calculated to be 0.47 pF/g with an acceleration range of ±5 g.},
journal = {American Journal of Applied Sciences},
publisher = {Science Publications}
}