TY  - JOUR
AU  - Jayapoorani, S. 
AU  - Ghosh, Dalim Kumar 
AU  - Shaik, Azad Mohammed 
PY  - 2011
TI  - A Novel Technique to Perform Plating on Printed Circuit Board
JF  - American Journal of Applied Sciences
VL  - 8
IS  - 10
DO  - 10.3844/ajassp.2011.989.991
UR  - https://thescipub.com/abstract/ajassp.2011.989.991
AB  - Problem statement: This research attempts to optimize the parameters for pulse plating of silver on printed circuit board. The idea here is to use pulse plating technique which is metal deposition by pulsed electrolysis method. Approach: Printed Circuit Boards (PCB) plays a major role in all communication and electronics industry. Silver is a ductile and malleable metal which has 7% higher conductivity than copper. Here the electro deposit is influenced by current density, silver concentration in the bath, applied current type. Pulse plating technique is used in double sided printed circuit board especially in the case of plated through hole technique. Here exist a necessity to do plating which will deposit a metal wall in the substrate and it will connect between the components. Results: This method of pulse plating proves that it avoids the disadvantage of rough deposition that is caused due to DC plating in PCB's. Conclusion: The surface morphology and the grain size is measured using XRD analysis and it proves that the number of pin holes is reduced.