Research Article Open Access

Ising Model for Conductive Percolation in Electrically Conductive Adhesives by Considering Random Arrangement of Conducting Particles

Mora1, Sahrul Saehana1, Euis Sustini1, Khairurrijal 1 and Mikrajuddin Abdullah1
  • 1 Department of Physics, Bandung Institute of Technology, Jalan Ganeca 10 Bandung 40132, Indonesia

Abstract

Problem statement: Thermodynamically, particles in composites will arrange in a way such that the Helmholtz free energy is minimized. However, even a single structure has the lowest free energy, it should not ignore the probability of other structures having larger energies to occur, although at small chances. Approach: All possible arrangements of particles in the composites, therefore, must be taken into account in the theory or simulation development. Results: The composite energy depends on the interaction between components in the composites. To consider the effect of interactions on energy, in this study we used a simple Ising model incorporated with the Bragg-Williams approximation. We used the model to predict the average packing fraction and the percolation threshold in composites as well as other quantities related to percolation phenomenon. Conclusion/Recommendations: We found several predictions that have not been reported by previous authors. This model can be important in the understanding conductivity development in electrically conductive adhesive composites.

American Journal of Applied Sciences
Volume 9 No. 7, 2012, 1113-1123

DOI: https://doi.org/10.3844/ajassp.2012.1113.1123

Submitted On: 14 March 2012 Published On: 30 May 2012

How to Cite: Mora, Saehana, S., Sustini, E., Khairurrijal, & Abdullah, M. (2012). Ising Model for Conductive Percolation in Electrically Conductive Adhesives by Considering Random Arrangement of Conducting Particles. American Journal of Applied Sciences, 9(7), 1113-1123. https://doi.org/10.3844/ajassp.2012.1113.1123

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Keywords

  • Electrically conductive adhesives
  • percolation
  • ising model
  • average coordination number
  • thermody namically
  • structures having
  • simulation development